Recently, the three-day China Packaging Container Expo concluded successfully at the National Exhibition and Convention Center in Shanghai. Shanghai Techsun, as one of the invited exhibitors, brought a series of star products — including smart caps, RFID tags, and LenScape materials— to brand clients, garnering widespread attention and acclaim from attendees across all sectors.
It is reported that this year’s China Packaging Container Expo brought together over 500 top packaging suppliers. Both the exhibition booths and various forums were bustling with crowds, presenting a truly spectacular scene, and the first day alone attracted over 23,000 professional visitors from home and abroad.
“Chip” Debut, the Future is Here
As one of the star products at the exhibition, the smart cap achieves a perfect integration of the RFID chip with the traditional cap. The RFID chip is embedded between the outer cap and the inner cap, and it breaks and is destroyed upon opening, eliminating the possibility of secondary replication or transfer, while supporting functions such as bottle-opening detection and marketing interaction. The RFID chip features uniqueness and high security, making it one of the most advanced technologies applied in the anti-counterfeiting field. It is also worth noting that the exhibition prominently featured Techsun’s RFID care labels applied to trendy apparel. By embedding the RFID chip into SMFK garment care labels, it realizes comprehensive anti-counterfeiting traceability and consumer-end interactive experience functions, providing all-round protection for product safety, and further enhancing brand value and recognition.
Concurrently, the expo hosted over 20 distinctive themed events, bringing together industry experts and leaders from the packaging supply chain and eight major end-use sectors to engage in dialogues on stage.
During the exhibition, Ms. Liu Chunyan, Senior R&D Director of Techsun, appeared at the Black Technology Forum, presenting Techsun’s innovative application solutions for the specialty packaging industry to exhibitors. She focused on introducing Techsun’s innovative technologies such as anti-counterfeiting labels, traceability systems, and specialty packaging. Based on the characteristics of Techsun’s self-developed RFID security chip, she shared the innovative applications of RFID products in the fields of smart caps and apparel.
Through this exhibition, we deeply felt the urgent demand from both domestic and international customers for the integration of anti-counterfeiting and packaging. We also witnessed the rapid development and transformation of the packaging industry, and observed the innovations and efforts of many renowned enterprises in the packaging field. This will undoubtedly inspire Techsun to continue staying true to its original aspiration, always adhering to the R&D philosophy of “One generation in application，one in reserve，one in R&D，and one in concept”, persistently innovating, boldly scaling new heights, and constantly exploring the infinite possibilities of anti-counterfeiting technology across various industries.
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